eSilicon, Northwest Logic and SK Hynix Create High-Bandwidth Memory (HBM) Hardware Demonstration

By on    Electronic Components, Picture Gallery  

eSilicon, Northwest Logic and SK Hynix Create High-Bandwidth Memory (HBM) Hardware Demonstration

SAN JOSE, CA — (Marketwired) — 09/10/15 — eSilicon Corporation, Northwest Logic and SK Hynix today announced they have created a fully working HBM hardware demonstration. This demonstration uses an advanced FPGA containing Northwest Logic–s HBM Controller Core and FPGA-based HBM PHY and SK Hynix HBM devices. eSilicon packaged the FPGA and HBM devices on an organic interposer. This demonstration is further indication that HBM is ready to be used by the market to implement a wide variety of h

eSilicon–s Javier DeLaCruz to Present: Cost Structure Advantages of 2.5D Integration

By on    Electronic Components, Picture Gallery  

eSilicon–s Javier DeLaCruz to Present: Cost Structure Advantages of 2.5D Integration

SAN JOSE, CA — (Marketwired) — 04/29/15 –Javier DeLaCruz, eSilicon–s senior director of product strategyHoliday Inn Conference Center
242 Adams
Boxborough, Massachusetts 01719May 5, 2015
10:40 AMVarious market dynamics are influencing the adoption of 2.5D integration. Recent developments have enabled 2.5D to provide feature enhancements, but if applied well may also provide significant cost benefits over what can be otherwise executed.As a senior director of product strategy at eSilicon Cor

eSilicon–s President and CEO, Jack Harding, Discusses the Changing Foundry Landscape at Mentor Graphics User Group Meeting

By on    Electronic Design Architecture, Picture Gallery  

eSilicon–s President and CEO, Jack Harding, Discusses the Changing Foundry Landscape at Mentor Graphics User Group Meeting

SAN JOSE, CA — (Marketwired) — 04/16/15 –DoubleTree by Hilton Hotel San Jose
2050 Gateway Place
San Jose, California 95110April 21, 2015Daniel Nenni, SemiWiki.com CEO & FounderJack Harding, eSilicon, president & CEOWally Rhines, Mentor Graphics, CEO & COBGiorgio Cesana, STMicroelectronics, director of technologyLluis Paris, TSMC, deputy director of worldwide IP allianceThe system on chip (SoC) business seriously challenged the semiconductor foundries at 28nm with increased integr

1 2