GlobeNet Expands Its Network Reach to Sao Paulo
The Addition of a Point of Presence in Sao Paulo Enables Enhanced International Connectivity Options for Customers
Cavendish Kinetics Adopts STATS ChipPAC–s Wafer Level Technology for Its SmarTune(TM) RF MEMS Tuners
Innovative RF MEMS Antenna Tuners Leverage Advanced Wafer Level Packaging to Provide OEMs With High Quality Chip Scale Packages
T5 Data Centers(TM) Adds a Level 3 Fiber “Point-of-Presence” in the T5@Atlanta Data Center
T5@Atlanta, the Southeast–s Premiere Multi-Tenant Data Center, Now Provides Its Customers Direct Access to the Level 3 Network by Way of an On-Site Point-of-Presence
STATS ChipPAC Receives Top 20 Semiconductor Manufacturing Patent Ranking for Fourth Consecutive Year
SINGAPORE–17 DECEMBER 2014, UNITED STATES — (Marketwired) — 12/16/14 — STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it has been ranked for the fourth consecutive year among the world–s top 20 semiconductor manufacturing companies in the Patent Power Scorecards published by the Institute of Electrical and Electronics Engineers (IEEE), the
Menasha Packaging, Shelfbucks to Launch First iBeacon –Smart Displays– for In-Store Retail Merchandising
Newest Generation of Menasha POP Displays Could Now Incorporate iBeacons and the Shelfbucks Smart Display Platform to Redefine POP Merchandising, Allowing Brands to Rapidly Measure and Adjust In-Store Campaigns for Enhanced Shopper Impact
STATS ChipPAC Delivers Industry Leading Ultra Thin Package-on-Package Solutions With eWLB Packaging
Recent Advances in Embedded Wafer Level Packaging Technology Reduce Bottom Package Height to Less Than 0.3mm for an Overall PoP Stack Height as Low as 0.8mm
STATS ChipPAC and Nanyang Technological University Collaborate on New Innovative Packaging Technologies
Partnership to Advance Breakthrough Solutions for Next Generation Semiconductor Packaging Technologies
STATS ChipPAC Honours Top Suppliers for Excellent Performance and Outstanding Support
SINGAPORE–23 JULY 2013, UNITED STATES — (Marketwired) — 07/22/13 — STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24) today announced the recipients of its sixth annual Supplier Awards, honouring the Company-s top suppliers in recognition of their excellent performance and outstanding support in 2012. The Supplier Awards program is designed to drive leadership in supply management to deliver the highest level of service, value and innovat
STATS ChipPAC Celebrates 1,000th U.S. Patent Milestone
Commitment to Innovation and Strong Focus on Advanced Wafer Level Technology Deliver Broad Portfolio of Intellectual Property
POP Acquired by Advance Publications
Leading Independent Digital Agency Joins Forces With Media and Publishing Powerhouse