Interoute cloud to open in Sydney
Global networked cloud platform grows its Asia Pacific footprint further
LINX Support Further Digital Growth for Scotland
The London Internet Exchange (LINX) have released a launch date for their newest point of presence (PoP) in Scotland, adding a second location to their regional Internet exchange platform, IXScotland, which was first established in 2013.
MOD Mission Critical Adds Points of Presence in Paris and Dublin
Offering Best-in-Breed Colocation and IP Services, MOD–s International Footprint Now Comprises 30 PoPs Worldwide
Telia Carrier launches new Internet backbone PoP in Berlin, bringing much-needed high speed, low latency connectivity to a flourishing region
Stockholm/Berlin – 6 April 2017 – Telia Carrier announced today that it has added a new point-of-presence (PoP) to its network, providing agile connectivity services for a booming economic sector in Berlin, Germany. The new data center, Carrier-Colo, owned by I/P/B/, is one of the most connected facilities in the region providing connectivity and other IP services to international, national and regional start-ups, carriers, cloud and content providers. Located between Frankfurt, Germany and Wars
Interoute opens for business in Miami to address strategic Americas demand
New Point-of-Presence expands Interoute’s Americas coverage and supports access to South America
Shelfbucks Further Expands Retail–s In-Store Digital Marketing Ecosystem Through Partnership With The Royal Group
The Royal Group Will Incorporate Shelfbucks –SmartDisplay(TM)– Platform Into Customer POP Displays to Enable Retailers and Brands to Measure and Optimize In-Store Merchandising Campaigns for Increased Sales
Green Bay Packaging Partners With Shelfbucks to Add –SmartDisplay(TM)– Offerings to In-Store Innovation Division
Shelfbucks Platform Will Transform Green Bay Packaging In-Store Displays to Digital Merchandising Solutions, Enabling Retailers and Brands to Rapidly Measure and Adjust In-Store Campaigns for Maximum Impact
Smiths Connectors Introduces Silmat® Elastomeric Test Sockets
Smiths Connectors announced today today the availability of Silmat® elastomeric test sockets, specifically targeted for digital high speed and PoP (package on package) test applications.
STATS ChipPAC Honored With Supplier of the Year Award From Inphi
SINGAPORE — 1 MARCH 2016, UNITED STATES — (Marketwired) — 02/29/16 — STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"), a leading provider of advanced semiconductor packaging and test services, today announced that it has been honored with the "Supplier of the Year" award from Inphi Corporation (NYSE: IPHI), a leading provider of high-speed, mixed-signal semiconductor solutions for the communications, computing and data center markets."With the rapidly
STATS ChipPAC Ranked in Top 10 Semiconductor Equipment Manufacturing Companies by IEEE for Patent Innovations
Highest Ranking Ever Received for an OSAT Provider