Vesper a Finalist for Innovation and Engineering Team Awards at Sensors Expo 2017
Industry–s first ZeroPower Listening piezoelectric MEMS microphone and its engineering team recognized for prestigious sensors-industry awards
Si-Ware Systems Announces NeoSpectra Micro Development Kits
Development with NeoSpectra Micro Ushers in the Era of Universal Material Analysis
MEMS & Sensors Industry Group Invites OEMs to Get Personal with MEMS and Sensors at CES 2017
January 5, 2017 conference track explores MEMS/sensors– connection to unique user experiences with consumer products
memsstar Completes Installation of Two MEMS Etch Systems for Bosch Next-Generation MEMS Process Development
LIVINGSTON, UNITED KINGDOM — (Marketwired) — 11/29/16 — announced today that it has installed two in Bosch–s German research and development facility in Renningen. The systems will be used in Bosch–s development efforts for the next generation of MEMS devices. Introduced in 2014, ORBIS systems deliver the industry–s most advanced single-wafer process capability for advanced MEMS manufacturing. memsstar is a leading provider of etch and deposition equipment and technology solutions to ma
Micralyne Appoints New COO to Drive Supply of MEMS/Sensors for IoT
Manufacturing Operations Industry Vet Darrell Mathison joins Micralyne as Chief Operating Officer
Entrepix Introduces Controls System Upgrade for OnTrak DSS 200 Double-Sided Cleaner
PHOENIX, AZ — (Marketwired) — 06/07/16 — Entrepix Inc., a leading provider of chemical mechanical polishing (CMP) equipment and process services, today announced the availability of a complete controls system upgrade for the OnTrak DSS 200 Double Sided Cleaner. The upgrade includes all new, state-of-the-art hardware and software that replaces 15+ year-old, unsupported legacy proprietary control technology."This controls system upgrade directly focuses on Entrepix–s mission to provide o
Semblant–s CEO Presents Nanocoating Solutions for Semiconductor, MEMS & Semiconductor Packaging at IMAPS 2016
SCOTTS VALLEY, CA — (Marketwired) — 03/16/16 — , the market leader in protective nanocoatings and liquid damage protection for broad market electronic devices, today announced that CEO Simon McElrea will present the company–s solutions for higher reliability and lower cost semiconductor wafer-level and package-level protection that enables thinner devices. The presentation will take place on March 16, 2016 at 2:30 p.m. as part of the 2016 IMAPS Device Packaging Conference. McElrea will also
Si-Ware Systems Launches Volume Production of NeoSpectra Sensor for Material Analysis
Smallest, Lowest-Cost Module Enables Innovative On-Site Mobile Applications
Consumer Electronics & Automotive OEMs/Integrators Invited to Explore MEMS & Sensors at 2016 CES
MEMS & Sensors Industry Group Speakers Share What–s New for Wearables, Smart Home, AR/VR, Autonomous Cars and the IoT
MIG Reveals MEMS & Sensors Technology Showcase Finalists at MEMS Executive Congress US 2015
Rollover Baby Monitor, Pedal-Assist Bike, Smart Horseshoes Among Top Products