PLX to Demonstrate, Present on Implementing PCI Express Fabrics in Data Centers at Supercomputing Conference

Highlights PCIe as Standalone Box-to-Box Fabric Within the Rack Using Standard Copper, Optical Cabling
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Highlights PCIe as Standalone Box-to-Box Fabric Within the Rack Using Standard Copper, Optical Cabling
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SUNNYVALE, CA and TAIPEI, TAIWAN — (Marketwired) — 10/17/13 — , Inc. (NASDAQ: PLXT), the global leader in PCI Express® (PCIe®) silicon and software connectivity enabling emerging data center architectures, today announced that Hung Chi, PLX® field applications director for the APAC region, will present on using PCIe for rack-level consolidation and convergence into a single interconnect technology during the upcoming , in Taipei, Taiwan. Chi-s presentation, titled , will cover ho
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SUNNYVALE, CA — (Marketwired) — 09/11/13 — (NASDAQ: PLXT), the global leader in PCI Express® (PCIe®) silicon and software connectivity solutions enabling emerging data center architectures, today announced its fully support and enhance the new Intel® Ivy Bridge® processor family. The combination of PLX® switches and PCIe-native Ivy Bridge processors enable high-performance servers in data centers and cloud computing environments to realize unprecedented interconnect des
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SUNNYVALE, CA — (Marketwired) — 07/29/13 — (NASDAQ: PLXT), the global leader in PCI Express® (PCIe®) silicon and software connectivity solutions enabling emerging data center architectures, today announced that Larry Chisvin, PLX® vice president of strategic initiatives, will chair a session on the blend of PCIe and solid-state drives (SSDs), at the upcoming . The PLX led session, titled features an array of panelists from industry leaders including , , , and . The session can
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Free Event Highlights PCIe Gen3 Architecture, Design Fundamentals
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Silicon-Proven MIPI Low Latency Interface (LLI) Digital Controller IP Enables Smaller and Thinner Phones, Reduces Compatibility Risk
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Exclusive Eighth Annual User Conference Returns to Miami
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Retains Patent Litigation Counsel, Files Patent Infringement Claim Against SonicsGN (SGN) Interconnect, and Asserts Non-Infringement and Invalidity of Sonics Patents
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C2C(TM) Chip-to-Chip Link IP Enables Lower Bill of Materials (BOM) Cost for TD-SCDMA and TD-HSPA Mobile Phones
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100 ns Latency Allows Mobile Phone Applications Processors and Modems to Share a Single DRAM, Saving $2 in Electronic Bill of Materials (BOM) Cost