integrated-circuit Archives

eSilicon to Attend GOMACTech 2016 Conference: More Than Moore and Beyond

By Publisher on March 9, 2016 Electronic Components, Picture Gallery

SAN JOSE, CA — (Marketwired) — 03/09/16 — eSilicon, a leading semiconductor design and manufacturing solutions provider, will participate at the 41st annual Government Microcircuit Applications & Critical Technology (GOMACTech) Conference in Orlando, Florida.eSilicon will discuss its and demonstrate itsMike Gianfagna, eSilicon–s vice president of marketing, and Joe Rash, eSilicon–s senior director of strategic salesMarch 14-17, 2016Booth 406
Wyndam Orlando Resort, Palms Ballroom
8001

Teledyne DALSA Semiconductor Announces Sample & Hold Precision Linear Amplifier IC for High Density MEMS/MOEMS Systems

By Publisher on April 5, 2012 Networking, Picture Gallery

WATERLOO, ONTARIO — (Marketwire) — 04/05/12 — Editors Note: There is one photo associated with this press release., a Teledyne Technologies company, announced today the availability of its . Using proprietary High Voltage CMOS/DMOS technology, the DH9665A is designed for next-generation, high density, small footprint, low power system requirements using MEMS or MOEMS activation with electrostatic forces. This device showcases Teledyne DALSA Semiconductor-s suite of product development and ma

Teledyne DALSA Semiconductor Announces Electrostatic Actuator Integrated Circuit for High Density MEMS/MOEMS Systems

By Publisher on February 28, 2012 Networking, Picture Gallery

WATERLOO, ONTARIO — (Marketwire) — 02/28/12 — Editors Note: There is a photo associated with this press release., a Teledyne Technologies company, announced today the availability of its . Using proprietary High Voltage CMOS/DMOS technology, the DH9685AB is designed for next-generation, high density, small footprint, low power system requirements using MEMS or MOEMS activation with electrostatic forces. This device showcases Teledyne DALSA Semiconductor-s suite of product development and man