RESEARCH TRIANGLE PARK, NC — (Marketwired) — 03/18/15 — , a developer and provider of patented, low-temperature direct bonding technology for 3D integration, today announced a patent licensing agreement with Sony Corporation for application in advanced image sensors. The agreement marks the continued adoption of Ziptronix–s hybrid bonding patents for high volume applications."This license agreement with Sony is an exciting milestone for Ziptronix because it removes any doubt that our p
Funding Round Moves Breakthrough QuantumFilm Imaging Products From R&D to Manufacturing; Includes Investment From GGV Capital and Nokia Growth Partners
After the successful participation at the international trade fair for machine vision in Shanghai, viimagic increases its activities for the new global shutter image sensor in China.
