National Grid Aerial Inspections Help Ensure Power System Reliability
Helicopter Inspections of Transmission Lines Underway This Week to Detect and Correct Potential Problems Before Outages Occur
Teledyne DALSA Semiconductor Announces Sample & Hold Precision Linear Amplifier IC for High Density MEMS/MOEMS Systems
WATERLOO, ONTARIO — (Marketwire) — 04/05/12 — Editors Note: There is one photo associated with this press release., a Teledyne Technologies company, announced today the availability of its . Using proprietary High Voltage CMOS/DMOS technology, the DH9665A is designed for next-generation, high density, small footprint, low power system requirements using MEMS or MOEMS activation with electrostatic forces. This device showcases Teledyne DALSA Semiconductor-s suite of product development and ma
Teledyne DALSA Semiconductor Announces Electrostatic Actuator Integrated Circuit for High Density MEMS/MOEMS Systems
WATERLOO, ONTARIO — (Marketwire) — 02/28/12 — Editors Note: There is a photo associated with this press release., a Teledyne Technologies company, announced today the availability of its . Using proprietary High Voltage CMOS/DMOS technology, the DH9685AB is designed for next-generation, high density, small footprint, low power system requirements using MEMS or MOEMS activation with electrostatic forces. This device showcases Teledyne DALSA Semiconductor-s suite of product development and man
NXP Extends LED Driver ICs for Compact, Non-Dimmable Lamps
SSL2108x Family Addresses Non-Isolated Topology; Provides Single Design Platform for 100V to 230V Markets