Report studies the global Flip-Chip Technologies market, analyzes and researches the Flip-Chip Technologies development status and forecast in United States, EU, Japan, China, India and Southeast Asia.
SINGAPORE — 1 MARCH 2016, UNITED STATES — (Marketwired) — 02/29/16 — STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company"), a leading provider of advanced semiconductor packaging and test services, today announced that it has been honored with the "Supplier of the Year" award from Inphi Corporation (NYSE: IPHI), a leading provider of high-speed, mixed-signal semiconductor solutions for the communications, computing and data center markets."With the rapidly
Highest Ranking Ever Received for an OSAT Provider
Innovative RF MEMS Antenna Tuners Leverage Advanced Wafer Level Packaging to Provide OEMs With High Quality Chip Scale Packages
SINGAPORE–17 DECEMBER 2014, UNITED STATES — (Marketwired) — 12/16/14 — STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it has been ranked for the fourth consecutive year among the world–s top 20 semiconductor manufacturing companies in the Patent Power Scorecards published by the Institute of Electrical and Electronics Engineers (IEEE), the
Recent Advances in Embedded Wafer Level Packaging Technology Reduce Bottom Package Height to Less Than 0.3mm for an Overall PoP Stack Height as Low as 0.8mm
Partnership to Advance Breakthrough Solutions for Next Generation Semiconductor Packaging Technologies
SINGAPORE–23 JULY 2013, UNITED STATES — (Marketwired) — 07/22/13 — STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24) today announced the recipients of its sixth annual Supplier Awards, honouring the Company-s top suppliers in recognition of their excellent performance and outstanding support in 2012. The Supplier Awards program is designed to drive leadership in supply management to deliver the highest level of service, value and innovat
Commitment to Innovation and Strong Focus on Advanced Wafer Level Technology Deliver Broad Portfolio of Intellectual Property
STATS ChipPAC-s Patent Portfolio Recognized for Its Quality, Strength and Overall Importance to the Semiconductor Manufacturing Industry