IDT Reports Fiscal 2018 Q2 Financial Results
– Q2 FY18 Revenue of $204.4 M, – Q2 FY18 GAAP Diluted EPS of $0.14, – Q2 FY18 Non-GAAP Diluted EPS of $0.35
Teledyne e2v presents Synchronizing and Triggering Multiple High Speed Digitizers at PXI Show China
CHENGDU, CHINA — (Marketwired) — 10/27/17 — Recently Teledyne e2v–s Field Application Engineer for Asia, Marc Stackler, was invited to speak at the PXI Show in Chengdu, China. He delivered a technical paper to address the topic of Synchronizing and Triggering Multiple High-speed Digitizers.In recent years, more and more systems require multiple channels to work simultaneously. And this is true for many types of applications, from test and measurement to communications, including big physics
IDT Addresses Challenges in Wearable and Small Form Factor Designs with a New Family of Compact Clock Generators
Fully-Programmable MicroClock(TM) Clock Generators Provide Flexibility and Ease Design Constraints in Compact, Battery-powered Applications
Avnet Demonstrated end-to-end LoRaWAN IoT Solutions at Cisco Next Intelligent IoT Generation Conference
HONG KONG, CHINA — (Marketwired) — 10/25/17 — Avnet Asia Pacific showcased its end-to-end LoRaWAN IoT solutions at the recent Cisco Next Intelligent IoT Generation Conference 2017, held at the Hong Kong Science Park.Avnet demonstrated various LoRaWAN applications that ranged from disaster prevention and smart agriculture to healthcare alert systems, allowing participants to explore myriad possibilities of the LoRaWAN-enabled IoT ecosystem to drive workplace insights and empower decision-maki
IDT Introduces Low Power UWB Motion Sensor
Newest UWB motion sensor provides accurate reporting of movement with low power requirements
IBM Scientists Demonstrate In-memory Computing with one million devices for applications in AI
?In-memory computing? or ?computational memory? is an emerging concept that uses the physical properties of memory devices for both storing and processing information. This is counter to current von Neumann systems and devices, such as standard desktop computers, laptops and even cellphones, which shuttle data back and forth between memory and the computing unit, thus making them slower and less energy efficient.
Today, IBM Research is announcing that its scientists have demonstrated that an uns
IDT Announces Industry–s First Power Management IC for DDR5 Server Memory Modules
SAN JOSE, CALIFORNIA — (Marketwired) — 10/24/17 — Integrated Device Technology, Inc. () (NASDAQ: IDTI) today introduced the industry–s first integrated power management IC (PMIC) developed for DDR5-based Dual In-Line Memory Modules (DIMM) and a broad range of other server memory applications. IDT–s enables the next-generation of server DIMM solutions to efficiently scale to greater performance, density and reliability while reducing overall system power.Machine learning, real-time analyti
Semblant to Present at Semiconductor and Material Events in Fourth Quarter of 2017
SCOTTS VALLEY, CA — (Marketwired) — 10/24/17 — Semblant, the global leader in innovating and deploying protective nanomaterials for the electronics industry, will be speaking at three major semiconductor and materials conferences during the remainder of the 4th quarter. Separate presentations will be delivered at the International Wafer-Level Packaging Conference 2017 (IWLPC) in San Jose, California, the American Vacuum Society (AVS) Symposium in Tampa, Florida and the IDTechEx 2017 Wearable
UltraSoC appoints Alberto Sangiovanni-Vincentelli as Chairman
CAMBRIDGE, United Kingdom, 24 October 2017 – UltraSoC today announced that Professor Alberto Sangiovanni-Vincentelli has joined the company as Non-Executive Chairman, bringing the benefits of his significant experience in the electronics design industry. The appointment comes as UltraSoC drives accelerating adoption of its IP for debug during chip design, and of its embedded intelligent analytics capabilities for monitoring wider system performance on all processor platforms: in particular the o
BIOS update enables Kaby Lake support
ICP Deutschland offers for different Skylake mainbaords and CPU cards with Intel® Q170, H110 or C236 chipset and socketl LGA1151 an BIOS update. That enables the usage of Kaby Lake processors.