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UltraSoC embedded analytics selected by ELVEES for video, security and safety applications across ARM and MIPS platforms

UltraSoC embedded analytics selected by ELVEES for video, security and safety applications across ARM and MIPS platforms

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First win for Nautech, UltraSoC’s new partner in Russia CAMBRIDGE, United Kingdom, 1 November 2017 - UltraSoC today announced that ELVEES has licensed UltraSoC’s embedded analytics technology for use in its next-generation video processing offerings. The new ELVEES system on chip (SoC) product will provide advanced capabilities for a broad…

ProPhotonix Adds New High-Power Ushio Red Laser diodes to Product Range

ProPhotonix Adds New High-Power Ushio Red Laser diodes to Product Range

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Two new high-power red laser diodes ideally suited to laser show, laser projection and optical instrumentation applications…

IDT Reports Fiscal 2018 Q2 Financial Results

IDT Reports Fiscal 2018 Q2 Financial Results

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- Q2 FY18 Revenue of $204.4 M, - Q2 FY18 GAAP Diluted EPS of $0.14, - Q2 FY18 Non-GAAP Diluted EPS of $0.35…

Teledyne e2v presents Synchronizing and Triggering Multiple High Speed Digitizers at PXI Show China

Teledyne e2v presents Synchronizing and Triggering Multiple High Speed Digitizers at PXI Show China

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CHENGDU, CHINA -- (Marketwired) -- 10/27/17 -- Recently Teledyne e2v--s Field Application Engineer for Asia, Marc Stackler, was invited to speak at the PXI Show in Chengdu, China. He delivered a technical paper to address the topic of Synchronizing and Triggering Multiple High-speed Digitizers.In recent years, more and more…

IDT Addresses Challenges in Wearable and Small Form Factor Designs with a New Family of Compact Clock Generators

IDT Addresses Challenges in Wearable and Small Form Factor Designs with a New Family of Compact Clock Generators

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Fully-Programmable MicroClock(TM) Clock Generators Provide Flexibility and Ease Design Constraints in Compact, Battery-powered Applications…

Avnet Demonstrated end-to-end LoRaWAN IoT Solutions at Cisco Next Intelligent IoT Generation Conference

Avnet Demonstrated end-to-end LoRaWAN IoT Solutions at Cisco Next Intelligent IoT Generation Conference

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HONG KONG, CHINA -- (Marketwired) -- 10/25/17 -- Avnet Asia Pacific showcased its end-to-end LoRaWAN IoT solutions at the recent Cisco Next Intelligent IoT Generation Conference 2017, held at the Hong Kong Science Park.Avnet demonstrated various LoRaWAN applications that ranged from disaster prevention and smart agriculture to healthcare alert…

IDT Introduces Low Power UWB Motion Sensor

IDT Introduces Low Power UWB Motion Sensor

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Newest UWB motion sensor provides accurate reporting of movement with low power requirements…

IBM Scientists Demonstrate In-memory Computing with one million devices for applications in AI

IBM Scientists Demonstrate In-memory Computing with one million devices for applications in AI

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?In-memory computing? or ?computational memory? is an emerging concept that uses the physical properties of memory devices for both storing and processing information. This is counter to current von Neumann systems and devices, such as standard desktop computers, laptops and even cellphones, which shuttle data back and forth between memory…

IDT Announces Industry–s First Power Management IC for DDR5 Server Memory Modules

IDT Announces Industry–s First Power Management IC  for DDR5 Server Memory Modules

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SAN JOSE, CALIFORNIA -- (Marketwired) -- 10/24/17 -- Integrated Device Technology, Inc. () (NASDAQ: IDTI) today introduced the industry--s first integrated power management IC (PMIC) developed for DDR5-based Dual In-Line Memory Modules (DIMM) and a broad range of other server memory applications. IDT--s enables the next-generation of server…

Semblant to Present at Semiconductor and Material Events in Fourth Quarter of 2017

Semblant to Present at Semiconductor and Material Events in Fourth Quarter of 2017

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SCOTTS VALLEY, CA -- (Marketwired) -- 10/24/17 -- Semblant, the global leader in innovating and deploying protective nanomaterials for the electronics industry, will be speaking at three major semiconductor and materials conferences during the remainder of the 4th quarter. Separate presentations will be delivered at the International Wafer-Level Packaging…


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