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efabless Launches Open Source Hardware Development Framework for IC Designs

efabless Launches Open Source Hardware Development Framework for IC Designs

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Chiplicity Offers Complete Flow to Design, Verify, Validate, Prototype Mixed-Signal ASICs…

OMVS: Robotic Assistance Devices Doubles Robot Reservations

OMVS: Robotic Assistance Devices Doubles Robot Reservations

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HENDERSON, NV -- (Marketwired) -- 07/13/17 -- On the Move Systems (OTC PINK: OMVS) is pleased to announce that Robotic Assistance Devices (RAD - ) has received an additional 15 robot reservations for a total of 30 robot reservations with total contract values of approximately $3 million. "We are…

M2SYS Selects Suprema BioMini Slim 2 Fingerprint Scanner for Its CloudABIS(TM) Biometric Software Solutions

M2SYS Selects Suprema BioMini Slim 2 Fingerprint Scanner for Its CloudABIS(TM) Biometric Software Solutions

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SEOUL, KOREA, July 12, 2017 - (ACN Newswire) - Suprema, a global leader in biometrics and ID solutions, announced that the company and its global network of partners can now leverage the M2SYS CloudABIS(TM) solutions suite to significantly ease the development and implementation efforts required for projects that use Suprema…

Light Engine Design Corp Announces OEM Contract with Rosco Laboratories, Inc.

Light Engine Design Corp Announces OEM Contract with Rosco Laboratories, Inc.

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FARMERS BRANCH, TX -- (Marketwired) -- 07/12/17 -- Light Engine Design Corp (OTC PINK: TLED) is pleased to announce the consummation of a multi-year product development and OEM contract with Rosco Laboratories, Inc. (Rosco), of Stamford, CT. Rosco is a global leader in the manufacturing of products in the…

IDT to Release First Quarter Fiscal Year 2018 Financial Results on July 31, 2017

IDT to Release First Quarter Fiscal Year 2018 Financial Results on July 31, 2017

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SAN JOSE, CALIFORNIA -- (Marketwired) -- 07/11/17 -- Integrated Device Technology, Inc. (IDT) (NASDAQ: IDTI) today announced that it will issue first quarter fiscal year 2018 financial results on July 31, 2017 after 1:00 p.m. Pacific Time. The Company will then host a conference call to discuss these results…

Helix Semiconductors– New eMpower HS100 Chipset Now Sampling

Helix Semiconductors– New eMpower HS100 Chipset Now Sampling

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Enables End-to-End Efficiency of More Than 90 Percent…

Entrepix Introduces NexGen Single-Wafer Wet Etch Equipment to North America

Entrepix Introduces NexGen Single-Wafer Wet Etch Equipment to North America

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PHOENIX, AZ -- (Marketwired) -- 07/11/17 -- Entrepix Inc., a leading provider of chemical mechanical polishing (CMP) equipment and process services, today announced that it has added the to its growing portfolio of new semiconductor manufacturing equipment. The company has entered into an agreement with NexGen Wafer Systems…

TEOCO to acquire CETECOM’s Mobile Communications Testing Services business in America

TEOCO to acquire CETECOM’s Mobile Communications Testing Services business in America

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Transaction will extend existing test service portfolio, and become the only device testing lab serving all four major US carriers…

Johnson Electric Reports Business and Unaudited Financial Information for the First Quarter of Financial Year 2017/18

Johnson Electric Reports Business and Unaudited Financial Information for the First Quarter of Financial Year 2017/18

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HONG KONG, CHINA -- (Marketwired) -- 07/11/17 -- This news release is made by ("Johnson Electric" or the "Company") (HKSE: 179) for the business operations and selected unaudited financial information of the Company and its subsidiaries (the "Group") for the quarter ended 30 June 2017.The Board of Directors…

Startup company Bitflux acquires technology from BayPAT

Startup company Bitflux acquires technology from BayPAT

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BayPAT, provider offering services in the area of technology transfer, IP management and commercialization, today announced that the startup company Bitflux GmbH and BayPAT have signed a purchase agreement for a technology used for the sensorless determination of the rotor position of electric motors. Basis for the agreement is…


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