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MALVERN, PA -- (Marketwire) -- 12/05/11 -- Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of HI-TMP® TANTAMOUNT® surface-mount solid tantalum molded chip capacitors with high-temperature capabilities from - 55 °C to + 175 °C with 50 % voltage derating. By operating at much higher temperatures…
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MALVERN, PA -- (Marketwire) -- 12/05/11 -- Vishay Intertechnology, Inc. (NYSE: VSH) today announced that its SiR870DP power MOSFET and 34 THE Hall effect sensor have won EDN China 2011 Innovation Awards. At an award ceremony on Dec. 1 in Shanghai, the SiR870DP received a Best Product Award…
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REDMOND, WA -- (Marketwire) -- 12/01/11 -- Data I/O Corporation (NASDAQ: DAIO), the leading provider of device programming and handling solutions worldwide, announced today the release of its Factory Integration Software (FIS) for PS Series Handlers. The company gave a preview of the software recently at the Productronica Tradeshow…
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Device Offers Wide Resistance Range From 0.1 Ohm to 100 Megohms in 0603, 0805, 1206, and 2010 Case Sizes…
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SINGAPORE--11/29/2011, UNITED STATES -- (Marketwire) -- 11/28/11 -- STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, today announced that it was recently named "Supplier of the Year" by Cirrus Logic, Inc. (NASDAQ: CRUS), a leader in high-precision, analog…
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LatticeECP3 FPGA Module for the AUTOMATA Sercos III Real-Time Ethernet Evaluation Kit…
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MALVERN, PA -- (Marketwire) -- 11/18/11 -- Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it has received a 2011 China Market Electronic Component Manufacturers Award (CMECMA) by China Electronic Market (CEM) magazine in the "Passive Components" category.CMECMA winners were determined by the results of the Purchasing Behavior…
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Trackspot Bolt(TM) Brings the Power of the CBM-360 Big Chip LED(TM) to the Industry-Standard Moving Mirror Lighting Fixture…
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SINGAPORE--10/28/2011, UNITED STATES -- (Marketwire) -- 10/28/11 -- ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, today announced results for the third quarter 2011.Tan Lay Koon, President and Chief Executive Officer of STATS ChipPAC, said, "Revenue for the third…
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Comprehensive HDBaseT Reference Design for the Surveillance Market Uses LatticeECP3 FPGA and Valens- VS100 HDBaseT Chipset…
