Trans-Lux Poised to Light Up 2012

New LED Solutions, Aggressive Business Initiatives and Successful Reorganization Continue to Gain Traction
By Publisher on Electronic Design Architecture, Picture Gallery
New LED Solutions, Aggressive Business Initiatives and Successful Reorganization Continue to Gain Traction
By Publisher on Electronic Design Architecture, Picture Gallery
Surface-Mount Receivers Feature Reception of Raw IR 3D Synchronization Signals Between 20 kHz and 60 kHz and 800 nm to 1000 nm Wavelength
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Components for 10 Additional EnerStore Systems Also Shipped to China JV Factory
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SOUTH SAN FRANCISCO, CA — (Marketwire) — 04/13/12 — (PINKSHEETS: WEMU) ("Worldwide" or the "Company"), a supplier of photovoltaic (PV) solar modules under the — brand, and a supplier of contract manufacturing services for mechanical and electronic products manufacturing, today is providing an update on its business activities.The Company is evaluating strategic alternatives in order to satisfy its creditors and to provide working capital for ongoing operations. These st
By Publisher on Electronic Design Architecture
Strategic Cooperation With Conax, Evolution Digital LLC and Cubiware Delivered Future-Driven Hybrid IP Video Solution for Cablemas Pay-TV Platform
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Non-Inductive Device Offers High Dielectric Strength up to 12 kV RMS and Overload Capability up to 2200 W for 10 Seconds
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SAN JOSE, CA — (Marketwire) — 04/10/12 — Sena Technologies, Inc., a leader in industrial Bluetooth, ZigBee and industrial networking solutions, announced the addition of the cost-effective Bluetooth v2.0+EDR Class 1 OEM SMD/DIP module, Parani-BCD110, to its popular Parani series industrial Bluetooth product line. The Parani-BCD110 is a Bluetooth Class 1 OEM SMD/DIP module combining antenna for OEM manufactures who want to implement Bluetooth Class 1 functionality with their products cost ef
By Publisher on Electronic Design Architecture
BYG23T Features Extremely High Reverse Voltage of 1,300 V and Fast 75 ns Reverse Recovery Time
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Lattice Will Demonstrate Camera Design Solutions at the ISC West Conference
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SINGAPORE–18/3/2012, UNITED STATES — (Marketwire) — 03/18/12 — STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, today provided an update on its outlook for the first quarter 2012.In its first quarter 2012 outlook published in the Company-s fourth quarter and full year 2011 results release dated 1 February 2012, the Company had expected net revenues to be mid single digit decre