VANCOUVER, BRITISH COLUMBIA — (Marketwired) — 09/22/15 — Intrinsyc Technologies Corporation (TSX: ITC) (“Intrinsyc”), a leading developer of intelligent connected devices, today announced it will manufacture and distribute the Qualcomm® Snapdragon Flight board featuring the Qualcomm® Snapdragon 801 processor. The Snapdragon Flight is a product of Qualcomm Technologies, Inc. (“QTI”), a subsidiary of Qualcomm Incorporated. The 801 processor consists of a quad-core Qualcomm® Krait 400 CPU with speeds up to 2.26 GHz, the Qualcomm® Adreno 330 GPU, and Qualcomm® Hexagon DSP (up to 800MHz).
The Snapdragon Flight is the first development board based on a Snapdragon 801 series processor targeted specifically for UAV, drone, and robotic devices. The Snapdragon Flight consists of a powerful and flexible system, featuring advanced processing power, real-time flight control running on the Hexagon DSP, Wi-Fi, Bluetooth connectivity, and automotive-grade GPS, all packed into a lightweight (less than 13g), tiny board (58x40mm) that is half the size of a credit card. It supports the Linux Kernel 3.4, and includes software tools needed to immediately begin development. Its size, weight and supported interfaces make it ideally suited for rapid development and deployment of high-performance, UAV and drone devices.
Customers can utilize Snapdragon Flight as is to create a solution functionally similar to one that is fully custom-engineered, with less technical risk, greater flexibility, and shorter development time. In addition to the base platform, Intrinsyc will offer accessories to support development including a complete “flight kit” with all components and instructions to build a prototype drone.
“We are excited to offer early access to Snapdragon Flight; enabling drone device makers to accelerate their development,” said Victor Gonzalez, Vice President of Engineering, Intrinsyc. “The Snapdragon Flight is a small and lightweight, yet comprehensive hardware and software platform that is a great starting point for companies building high-performance UAV and drone devices.”
Users will receive product documentation, access to complimentary tools and software updates, and technical support or product development assistance through Intrinsyc–s technical support services. The platform will be made available to select clients as part of an early adopter program beginning in October, with general customer availability in early 2016. Please visit Intrinsyc at for more technical information and availability updates.
Intrinsyc will showcase the new Snapdragon Flight at RoboBusiness which will be held at San Jose Convention Center, San Jose, CA, from September 23-24, 2015.
About Intrinsyc Technologies Corporation
is a product development company that provides hardware, software, and engineering and production services that enable rapid commercialization of intelligent connected products. Solutions span the development life cycle from concept to production and help device makers and technology suppliers create compelling differentiated products with faster time-to-market. Intrinsyc–s Open-Q System on Modules incorporate the industry–s most advance Snapdragon processor technology from Qualcomm Technologies Inc., and help OEMs to rapidly bring industry leading products, with rich functionality and high performance, to market . Intrinsyc is publicly traded (TSX: ITC) and is headquartered in Vancouver, BC, Canada.
Intrinsyc and Open-Q are trademarks of Intrinsyc Technologies Corporation, Qualcomm Snapdragon, Qualcomm Krait, Qualcomm Adreno, and Qualcomm Hexagon are products of Qualcomm Technologies, Inc.
Qualcomm, Snapdragon, Adreno, and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Krait and Snapdragon Flight are trademarks of Qualcomm Incorporated. All Qualcomm Incorporated trademarks are used with permission.
All other product, brand and company names herein may be trademarks or registered trademarks of their respective owners.
Contacts:
Intrinsyc Technologies Corporation
George Reznik
Chief Financial Officer/Investor Relations
+1-604-801-6461
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