SINGAPORE–23 JULY 2013, UNITED STATES — (Marketwired) — 07/22/13 — STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company”) (SGX-ST: STATSChP) (SGX: S24) today announced the recipients of its sixth annual Supplier Awards, honouring the Company-s top suppliers in recognition of their excellent performance and outstanding support in 2012. The Supplier Awards program is designed to drive leadership in supply management to deliver the highest level of service, value and innovation for STATS ChipPAC and its customers. Supplier partnerships are evaluated on multiple criteria including technology, quality, delivery, responsiveness, service and cost competiveness.
Six companies received STATS ChipPAC-s top honour, “Best Supplier Award”, for overall best-in-class performance in cost, quality, delivery, technology, service and support. Nine companies were recognised with “Outstanding Award in Service and Support” for overall excellent performance, service and support. There were six companies that were recognised with “Outstanding Site Award in Service and Support” for their significant impact on a particular STATS ChipPAC manufacturing site. The winners by category are:
Advantest Corporation
Daewon SPIC/Peak International
Duksan Hi-Metal Co., Ltd.
Kinsus Interconnect Technology Corporation
Kulicke & Soffa Industries, Inc.
NAMICS Corporation
BE Semiconductor Industries N.V.
EO Technics Co., Ltd.
Lam Research Corporation
Mitsui High-tec Inc.
MK Electron Co., Ltd.
Nagase & Co., Ltd.
Samsung Electro-Mechanics Co., Ltd.
Teradyne, Inc.
UBoT Incorporated Limited
FedEx Express (for STATS ChipPAC Singapore/ STATS ChipPAC Malaysia)
Henkel Adhesive Technologies – Electronics (for STATS ChipPAC Korea)
Hon. Technologies, Inc (for STATS ChipPAC Shanghai)
Oriental Mercury International Cargo Transportation Co., Ltd. (for STATS ChipPAC Shanghai)
Simmtech Co., Ltd. (for STATS ChipPAC Singapore)
Tanaka Kikinzoku International K.K. (for STATS ChipPAC Singapore)
“Our partnership with our suppliers worldwide plays an integral role in enabling STATS ChipPAC to deliver the highest level of quality and service for our customers. We are pleased to honour our award recipients who have demonstrated outstanding commitment and performance in providing STATS ChipPAC and our customers with the best value, innovation, highest quality products and services,” said Wan Choong Hoe, Executive Vice President and Chief Operating Officer, STATS ChipPAC. “We congratulate all of our top suppliers for their achievements.”
STATS ChipPAC Ltd. (SGX-ST Code: S24) is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices throughout Asia, the United States and Europe. STATS ChipPAC is listed on the SGX-ST. Further information is available at . Information contained in this website does not constitute a part of this release.
Tham Kah Locke
Vice President of Corporate Finance
Tel: (65) 6824 7788
Fax: (65) 6720 7826
email:
Lisa Lavin
Deputy Director of Marketing Communications
Tel: (208) 867-9859
email:
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