VANCOUVER, BRITISH COLUMBIA — (Marketwired) — 06/27/13 — Intrinsyc Software International (“Intrinsyc” or the “Company”) (TSX: ICS), a leading developer of mobile and embedded devices announced today the availability of a new DragonBoard Development Kit and production-ready System-On-Module (“SoM”) featuring the Qualcomm Snapdragon 800 APQ8074 processor from Qualcomm Technologies, Inc. The new development kit will empower the hardware community to integrate and innovate for devices based on Qualcomm Snapdragon processors, as well as provide OEMs, developers and engineers with next generation software technology and tools to accelerate development and testing.
The Qualcomm Snapdragon 800 processor offers ground-breaking CPU, DSP and GPU performance, energy efficiency and rich multimedia capabilities for embedded computing applications. The Qualcomm Snapdragon 800 processor also features asynchronous quad-core Krait CPUs with up to 2.3GHz each, Adreno 330 GPU, Ultra HD video capture and playback, and a Hexagon QDSP6 for low-power applications and custom programmability.
In addition to featuring the Qualcomm Snapdragon 800 processor, the DragonBoard will offer a Qseven form factor SoM, memory, GNSS, Wi-Fi (802.11n/ac), BT4.0, as well as a Mini-ITX form factor Carrier board hosting ANC Headset jack, 5.1 surround sound stereo output, 2x USB 3.0 ports and 2x USB 2.0 Ports, and micro-AB USB. The development kit will also feature Gigabit Ethernet, HDMI output, Dual SATA, GPIO, Education Connector, JTAG connector and LCD Display. The DragonBoard is based on Android 4.2; the Open-Q 8074 SoM will be provided with Android or embedded Linux.
“We are very excited to bring the advanced computing performance of a Qualcomm Snapdragon 800 processor to the hardware community and the embedded space, as these processors are being designed into the world-s next generation mobile devices,” said Tracy Rees, President and CEO of Intrinsyc. “The DragonBoard is a comprehensive development platform that enables driver development and a great starting point for creating high-performance, low power products for vertically integrated industries, such as robotics, wearable computing, digital signage, kiosks, medical device, to name a few.”
Intrinsyc, in conjunction with Qualcomm Technologies, will showcase the DragonBoard and Open-Q 8074 SoM at the Wearable Tech Conference in New York in July. The DragonBoard development platform will also be shown at Qualcomm-s wireless ecosystem conference, Uplinq 2013, in San Diego.
Users will receive product documentation and access to complimentary tools and software updates, as well as receive additional support through Intrinsyc-s technical support services. The DragonBoard 8074 is offered for purchase at . For additional product information, go to .
Forward-Looking Statements
This press release contains statements which, to the extent that they are not recitations of historical fact, may constitute forward-looking information under applicable Canadian securities legislation that involve risks and uncertainties. Such forward-looking statements or information may include financial and other projections as well as statements regarding the Company-s future plans, objectives, performance, revenues, growth, profits, operating expenses or the company-s underlying assumptions. The words “may”, “would”, “could”, “will”, “likely”, “expect,” “anticipate,” “intend”, “plan”, “forecast”, “project”, “estimate” and “believe” or other similar words and phrases may identify forward-looking statements or information. Persons reading this press release are cautioned that such statements or information are only predictions, and that the Company-s actual future results or performance may be materially different. Factors that could cause actual events or results to differ materially from those suggested by these forward-looking statements include, but are not limited to: the need to develop, integrate and deploy software solutions to meet the Company-s customer-s requirements; the possibility of development or deployment difficulties or delays; the dependence on the Company-s customer-s satisfaction; the timing of entering into significant contracts; customers- continued commitment to the deployment of the Company-s solutions; the performance of the global economy and growth in software industry sales; market acceptance of the Company-s products and services; the success of certain business combinations engaged in by the Company or by its competitors; possible disruptive effects of organizational or personnel changes; technological change, new products and standards; risks related to international expansion; concentration of sales; international operations and sales; dependence upon key personnel and hiring; reliance on a limited number of suppliers; industry growth; competition; intellectual property; product defects and product liability; currency exchange rate risk; and other factors described in the Company-s reports filed on SEDAR, including its Annual Information Form and financial report for the year ended December 31, 2012. This list is not exhaustive of the factors that may affect the Company-s forward-looking information. These and other factors should be considered carefully and readers should not place undue reliance on such forward-looking information. All forward-looking statements made in this press release are qualified by this cautionary statement and there can be no assurance that actual results or developments anticipated by the Company will be realized. The Company disclaims any intention or obligation to update or revise forward-looking information, whether as a result of new information, future events or otherwise, except as required by law.
About Intrinsyc Software International, Inc.
Intrinsyc Software International, Inc. () is a product development company that provides hardware, software, and service solutions that enable next-generation embedded and wireless products. Solutions span the development life cycle from concept to production and help device makers and technology suppliers create compelling differentiated products with faster time-to-market. Intrinsyc is publicly traded (TSX: ICS) and is headquartered in Vancouver, BC, Canada.
Open-Q is a trademark of Intrinsyc Software.
Qualcomm, Snapdragon, DragonBoard, Adreno and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. All Qualcomm Incorporated trademarks are used with permission. Other products or brand names may be trademarks or registered trademarks of their respective owners.
Contacts:
Intrinsyc Software International, Inc.
Tracy Rees
Chief Executive Officer
+1-604-801-6461
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