SHANGHAI — (Marketwired) — 06/12/13 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced its technology lineup for the 2013 CEF (China Electronics Fair) Summer Chengdu show, taking place June 20-22 at the Chengdu Century City New International Convention and Exhibition Center. In hall 3, booth A214, the company will be highlighting its latest industry-leading innovations, including passive components, diodes, power MOSFETs, power ICs, and optoelectronics.
At the 2013 CEF, Vishay Siliconix will be showcasing TrenchFET® Gen IV MOSFETs with maximum on-resistance down to 0.00135 ohms at a 4.5 V gate drive; 600 V and 650 V E Series devices for increased efficiency; and 50 W front-lighting LED drivers in PowerPAK® SO-8L and 8x8L packages. Highlighted power ICs will include 28 V programmable, protected smart load switches in the 3 mm by 3 mm DFN10 package; high-density 60 A power stages in 5 mm by 5 mm packages; and 100 V full-bridge PWM controller power stages.
Vishay Semiconductors will be featuring a variety of diodes, including 45 V to 120 V TMBS® Trench MOS Barrier Schottky rectifiers in the SMPD package and 50 V high current density devices; Gen2 650 V FRED Pt® Ultrafast diodes for electric vehicles, UPS, and solar inverters; and FRED Pt Hyperfast and Ultrafast recovery rectifiers.
In addition, Vishay Semiconductors will highlight surface-mount PAR® and TRANSZORB® transient voltage suppressors (TVS), and optoelectronics products such as white high-brightness, high-power LED modules; high-brightness 0402 and 0603 ChipLEDs; and fully integrated proximity and ambient light sensors.
Passive components from Vishay will consist of a wide variety of the company-s latest capacitors, resistors, and inductors. Highlighted resistors will include Vishay Beyschlag high-current thermal fuses with operating temperature to 235 degrees C; Vishay Draloric 20 kW stainless steel power resistors; and Vishay Dale Power Metal Strip® battery shunt resistors with molded enclosures.
Featured capacitors will include Vishay Vitramon high-frequency RF and microwave MLCCs; Vishay Roederstein film capacitors with high peak current capabilities for DC-link and AC applications; and Vishay ESTA power capacitors. Featured capacitors will also include Vishay Sprague Microtan® solid tantalum chip capacitors and Vishay wet tantalum capacitors.
Vishay Dale will be showcasing inductors such as low-profile, high-current IHLP® devices; IHCL coupled inductors for LED SEPIC converters circuits; and IWAS wireless charging Rx and Tx coils.
In addition, Vishay will be offering two demonstrations in its booth at the 2013 CEF. Vishay Siliconix will be demonstrating the thermally and electrically optimized SiZF904DT PowerPAIR® TrenchFET IV power MOSFETs. Vishay Semiconductors will be providing a system demonstration that highlights the low forward voltage and fast turn-on times of TMBS rectifiers and the high impedance and reduced signal loss of low CJ TVS.
CEF is the leading and most comprehensive exhibition of the electronics and information industry in West China. More information is available at .
, a Fortune 1000 Company listed on the NYSE (VSH), is one of the world-s largest manufacturers of discrete semiconductors (diodes, MOSFETs, and infrared optoelectronics) and passive electronic components (resistors, inductors, and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial, computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay-s product innovations, successful acquisition strategy, and “one-stop shop” service have made it a global industry leader. Vishay can be found on the Internet at .
TrenchFET, PowerPAK and PowerPAIR are registered trademarks of Siliconix incorporated. MICROTAN, TMBS, FRED Pt., PAR, TRANSZORB, IHLP and Power Metal Strip are registered trademarks of Vishay Intertechnology.
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