SAN JOSE, CA — (Marketwired) — 06/03/13 —
ProPlus Design Solutions, Inc. (), the global leader for SPICE modeling solutions and the leading technology provider for Design-for-Yield (DFY) applications
: Will demonstrate its entire DFY product portfolio in a journey “From Nano-Scale Modeling to Giga-Scale Simulations” during the 50th Design Automation Conference (DAC) in Booth #1525. ProPlus will celebrate the 20th anniversary of BSIMProPlus, the industry-s leading modeling platform for nanometer devices used by all leading foundries, and DAC-s 50 years of innovation as a contributing sponsor of Kickin- it Up in Austin.
Monday, June 3, through Wednesday, June 5, from 9 a.m. until 6 p.m. daily. The DAC party will be held Monday, June 3, from 8 p.m. until 1 a.m.
Austin Convention Center, Austin, Texas
Throughout the three days, DAC attendees will be introduced to, and offered performance benchmarking data and demonstrations of:
NanoSpice, a next-generation giga-scale high-performance parallel SPICE simulator able to handle 100-million+ element designs and the core engine of BSIMProPlus
NanoYield, a fast, accurate yield versus power, performance, area (PPA) analysis platform for memory, analog and digital designs with High-Sigma Monte Carlo capabilities licensed from and validated by IBM
A complement of large post-layout analog and memory cases
FinFET modeling, simulation and High-Sigma applications showcasing ProPlus- product capabilities for handling the most advanced process technology
ProPlus will host a daily drawing in its booth for an iPad mini and a Samsung Galaxy Tab 2 to celebrate the BSIMProPlus family products- anniversary and the launch of its new products.
To register for a demonstration or for more information about ProPlus Design Solutions, visit . Details on a complete listing of its DAC events can be found at: .
DAC-s website location is: .
ProPlus Design Solutions, Inc. delivers Electronic Design Automation (EDA) solutions with the mission to enhance the link between design and manufacturing. It is the global leader for SPICE modeling solutions and the leading technology provider for unique Design-for-Yield (DFY) products that integrate the key DFY components — advanced device modeling software, a parallel SPICE simulation circuit simulator and hardware-validated statistical variation analysis tools. Products include: BSIMProPlus/Model Explorer, a modeling technology platform for nanometer devices; NoisePro/9812B/9812D, the golden solution for low-frequency 1/f noise and Random Telegraph Signal (RTS) noise characterization and process monitoring; NanoSpice, a high-capacity, high-performance parallel SPICE simulator for giga-scale circuit simulation; and NanoYield/NanoExplorer, a variation analysis platform for yield versus power, performance and area trade-off of memory, analog and digital circuit designs. ProPlus Design Solutions has R&D centers in the San Jose, Calif. and Beijing and Jinan, China, with sales offices in Tokyo, Japan, Hsinchu, Taiwan, and Shanghai, China. More information about ProPlus Design Solutions can be found at .
BSIMProPlus, Model Explorer, NanoExplorer, NanoSpice, NanoYield and NoisePro are registered trademarks of ProPlus Design Solutions. ProPlus Design Solutions acknowledges trademarks or registered trademarks of other organizations for their respective products and services.
For more information, contact:
Nanette Collins
Public Relations for ProPlus Design Solutions
(617) 437-1822
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