SUNNYVALE, CA — (Marketwired) — 05/29/13 —
eSilicon will present on emerging packaging technologies as well as advanced physical IP — including the challenges of FinFET and FD-SOI technologies that will take us to 14nm.
Design Automation Conference (DAC 2013)
Austin, Texas
June 2-5, 2013
ChipEstimate.com Booth #2446
eSilicon-s Patrick Soheili, VP and GM, IP Solutions Group, and Lisa Minwell, senior director, IP Solutions Marketing, will present.
Monday, June 3, 11:30 AM
Tuesday, June 4, 2:00 PM
Wednesday, June 5, 1:30 PM
GLOBALFOUNDRIES Open Theater Booth #1314
eSilicon-s Patrick Soheili, VP and GM, IP Solutions Group, will present.
Tuesday, June 4, 3:45 PM
GLOBALFOUNDRIES Open Theater Booth #1314
eSilicon-s Gino Skulick, VP and GM, SDMS Solutions, will present an integrated approach to a very low cost, low power, small form factor device produced for the mobile market.
Monday, June 3, 2:45 PM
Wednesday, June 5, 11:05 AM
GLOBALFOUNDRIES Private Theater Booth #1314
eSilicon-s Lisa Minwell, senior director, IP Solutions Marketing, will present.
Wednesday, June 5, 2:00 PM
eSilicon, the largest independent semiconductor design and manufacturing services provider, delivers custom ICs and custom IP to OEMs, independent device manufacturers (IDMs), fabless semiconductor companies (FSCs) and wafer foundries through a fast, flexible, lower-risk path to volume production. eSilicon serves a wide variety of markets including the communications, computer, consumer and industrial segments. .
eSilicon — Enabling Your Silicon Success
eSilicon and eSilicon Access are registered trademarks, and the eSilicon logo and Enabling Your Silicon Success are trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners.
Sally Slemons
eSilicon Corporation
408-616-4695
Susan Cain
Cain Communications
408-393-4794
You must be logged in to post a comment Login