FREMONT, CA — (Marketwire) — 07/02/12 — Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that it has shipped its Millios® millisecond annealing (MSA) system to a major semiconductor manufacturer. This second Millios to this customer will be installed in the chipmaker-s newest fab for the development and production of advanced logic devices.
“The mobile electronics era demands ever-smaller chips with high-performance and low power consumption, which is set at the transistor fabrication stage,” said Johannes Keppler, MSA and RTA business leader of Mattson Technology-s Thermal Products Group. “The system-s ability to perform selectable short time scale processing enables our customers to meet the more stringent device performance for today-s transistor fabrication in a single high-speed step to minimize cost and maximize efficiency. The Millios was designed to deliver the industry-s highest throughput and lowest cost of ownership at leading-edge technology nodes. We look forward to supporting our customer with this high-performance millisecond annealing tool to produce leading-edge logic chips for today-s advanced electronics devices.”
Mattson Technology, Inc. designs, manufactures and markets semiconductor wafer processing equipment used in the fabrication of integrated circuits. We are a leading supplier of plasma and rapid thermal processing equipment to the global semiconductor industry, and operate in three primary product sectors: Dry Strip, Rapid Thermal Processing and Etch. Through manufacturing and design innovation, we have produced technologically advanced systems that provide productive and cost-effective solutions for customers fabricating current- and next-generation semiconductor devices. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, CA, 94538. Telephone: (800) MATTSON / (510) 657-5900. Internet: .
” This news release contains forward-looking statements. All statements other than statements of historical fact are statements that could be deemed forward-looking statements, including but not limited to statements of the plans, strategies and objectives of management for future operations. Forward-looking statements address matters that are subject to a number of risks and uncertainties that can cause actual results to differ materially from those expressed or implied by such forward-looking statements and assumptions. Such risks and uncertainties include, but are not limited to: macroeconomic and geopolitical trends and events; end-user demand for semiconductors; customer demand for semiconductor manufacturing equipment; the timing of significant customer orders for the Company-s products; customer acceptance of delivered products and the Company-s ability to collect amounts due upon shipment and upon acceptance; the Company-s ability to timely manufacture, deliver and support ordered products; the Company-s ability to bring new products to market and to gain market share with such products; customer rate of adoption of new technologies; risks inherent in the development of complex technology; the timing and competitiveness of new product releases by the Company-s competitors; the Company-s ability to align its cost structure with market conditions; and other risks and uncertainties described in the Company-s Forms 10-K, 10-Q and other filings with the Securities and Exchange Commission. The Company assumes no obligation to update the information provided in this news release.
Lauren Vu
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J. Michael Dodson
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