HILLSBORO, OR — (Marketwire) — 02/15/12 — Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced its plans for Embedded World 2012, which will take place Feb 28th – March 1st in Nuremberg, Germany. Lattice will be exhibiting in Hall 5, Stand 142, and will be featuring among other things its recently announced LatticeECP4 family of devices.
On the stand there will be demonstrations of Lattice solutions for PCI Express and various camera solutions that are ideal for embedded, automotive and industrial applications.
PCI Express will be demonstrated using a LatticeECP3 family PCI Express Development Kit, which is a complete hardware/software development environment to help accelerate the evaluation of PCI Express technology, get to a known good starting point for a design and then easily transition to design exploration. In addition, Lattice and Trellisys Ltd will demonstrate a robust and cost-effective PCIe Bus Functional Model (BFM) for Lattice-s PCI Express x1 and x4 IP Cores, which will enable users to reduce design complexity and shrink the time-to-market window for their PCI Express designs.
Lattice will be demonstrating Industrial camera solutions that show a full ISP (Image Signal Processor) function embedded into FPGAs at up to 1080p60. Additionally there will be a demonstration showing solutions that can bridge two or more sensors to an ISP. Many low cost ISPs can support two cameras from a processing power aspect but they only have one interface. This demonstration allows existing ISPs which were designed to interface to only one camera to support two or more. Applications such as industrial automation, 3D cameras and automotive surround view are examples where multiple cameras can be used.
The demonstration will show how solutions based on programmable Logic can provide cost effective and flexible platforms for the increasing demands of video capture systems.
The MachXO2 devices provide embedded designers an unprecedented mix of low cost, low power and high system integration. The MachXO2 family delivers a 3X increase in logic density, a 10X increase in embedded memory, more than a 100X reduction in static power and up to 30% lower cost compared to the prior generation MachXO PLD family. These devices are ideally suited for the most popular functions used in embedded (telecom infrastructure, computing, high end industrial, high end medical) and embedded (digital TVs, smart phones, GPS devices, mobile computing, digital cameras).
The LatticeECP4 FPGA family, with 6 Gbps SERDES in low cost wire-bond packages, powerful DSP Blocks and hard IP-based Communication Engines is engineered for cost- and power-sensitive wireless, wireline, video, and computing markets. The LatticeECP4 FPGA family builds on the award winning LatticeECP3 family by bringing premium features to mainstream customers while maintaining industry-leading low power and low cost. The LatticeECP4 devices are ideal for developing mainstream platforms for a variety of applications such as Ethernet Aggregation, Switching, Routing, Industrial Networking, Video Signal Processing, Video Transmission and Data Center Computing.
The ultra-low-power iCE40 devices deliver the lowest power in the smallest package. Addressing the vast array of design requirements for mobile products, the iCE40 family is ideal for industrial hand held inventory scanners, ruggedized mobile devices or other battery powered applications.
Lattice is the source for innovative , , programmable and solutions. For more information, visit . Follow Lattice via , and .
Lattice Semiconductor GmbH
Lilienthal Str. 27
85399 Hallbergmoos
GERMANY
Tel: (49) 0700 1 5288423
Fax: (49) 811 55056 90
Email:
Ted Marena
Director Business Development
Lattice Semiconductor Corporation
+1 781 937 5511
Bernie Perrin
Tel: +44 1483 832942
Mob: +44 7980 749178
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