FREMONT, CA — (Marketwire) — 02/01/12 — Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that it has won acceptance for its Helios® XP rapid thermal processing (RTP) system from a third foundry customer. The Helios XP, which was selected by the customer as a result of its success in enabling advanced transistor production while minimizing cost of ownership, will be used for the volume production and development of next-generation integrated circuits (ICs).
“Our customer selected The Helios XP based on the system-s unique ability to minimize wafer stress and pattern loading effects, while providing the full-spectrum temperature control technology required to achieve the transistor density for tomorrow-s mobile processors,” said Johannes Keppler, rapid thermal annealing (RTA) business leader of Mattson Technology-s Thermal Products Group. “The Helios XP has won acceptance for a wide range of advanced thermal applications and is now established in three different logic/foundry customers. We will continue to provide the RTP solutions that deliver the exceptional processing performance and manufacturing flexibility chipmakers require to produce leading-edge high-performance, low-power mobile devices.”
Mattson Technology, Inc. designs, manufactures and markets semiconductor wafer processing equipment used in the fabrication of integrated circuits. We are a leading supplier of plasma and rapid thermal processing equipment to the global semiconductor industry, and operate in three primary product sectors: Dry Strip, Rapid Thermal Processing and Etch. Through manufacturing and design innovation, we have produced technologically advanced systems that provide productive and cost-effective solutions for customers fabricating current- and next-generation semiconductor devices. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, CA, 94538. Telephone: (800) MATTSON / (510) 657-5900. Internet: .
” This news release contains forward-looking statements. All statements other than statements of historical fact are statements that could be deemed forward-looking statements, including but not limited to statements of the plans, strategies and objectives of management for future operations. Forward-looking statements address matters that are subject to a number of risks and uncertainties that can cause actual results to differ materially from those expressed or implied by such forward-looking statements and assumptions. Such risks and uncertainties include, but are not limited to: macroeconomic and geopolitical trends and events; end-user demand for semiconductors; customer demand for semiconductor manufacturing equipment; the timing of significant customer orders for the Company-s products; customer acceptance of delivered products and the Company-s ability to collect amounts due upon shipment and upon acceptance; the Company-s ability to timely manufacture, deliver and support ordered products; the Company-s ability to bring new products to market and to gain market share with such products; customer rate of adoption of new technologies; risks inherent in the development of complex technology; the timing and competitiveness of new product releases by the Company-s competitors; the Company-s ability to align its cost structure with market conditions; and other risks and uncertainties described in the Company-s Forms 10-K, 10-Q and other filings with the Securities and Exchange Commission. The Company assumes no obligation to update the information provided in this news release.
Lauren Vu
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Laura Guerrant-Oiye
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