“ASSET’s ScanWorks platform provides a rich set of functionality for embedded diagnostics,” said Peg Williams, senior vice president of research and development at Cray. “ScanWorks-based solutions will enable Cray’s next-generation product development to maintain a focus on quality and reliability, while continuing to push the envelope in scalability. This is a real differentiator for Cray’s next-generation supercomputers and we believe it will give us a competitive advantage in the marketplace.”
ScanWorks embedded IP provides fault isolation in high-availability, mission-critical systems in the computer, telecom, military and aerospace, and storage markets. Its capabilities include single and multi-processor bring-up, remote test, kernel dump, hung system debug, and breakpoints. This functionality can be critical for installation and commissioning, local and remote testing and programming, and reducing “No Trouble Found” (NTF) reports from the field.
“We are very excited about working with Cray and delivering the embedded test and diagnostic IP that will retain the leadership position its supercomputers have achieved in the marketplace,” said Alan Sguigna, ASSET’s vice president of sales and marketing. “Cray’s commitment to reliability shows why the company has consistently led the supercomputer market segment.”
ScanWorks® – The Embedded Instrumentation Platform
ASSET, through its ScanWorks platform, is applying the experience it has gained from two decades as a leading supplier of boundary-scan test tools to the development of open embedded instrumentation tools. The boundary-scan infrastructure that is embedded into chips and circuit boards is one of several technologies that can form the basis for an embedded instrumentation toolset. In recent years, ASSET has significantly enhanced its ScanWorks® platform with embedded instrumentation capabilities such as processor-controlled test (PCT) and tools for Intel® IBIST (Interconnect Built-In Self Test), an embedded instrumentation technology that Intel® and other companies are embedding into next-generation chips and chipsets.
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