SINGAPORE — 1 MARCH 2016, UNITED STATES — (Marketwired) — 02/29/16 — STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company”), a leading provider of advanced semiconductor packaging and test services, today announced that it has been honored with the “Supplier of the Year” award from Inphi Corporation (NYSE: IPHI), a leading provider of high-speed, mixed-signal semiconductor solutions for the communications, computing and data center markets.
“With the rapidly increasing volumes of data moving through cloud-based architectures, Inphi strives to provide our customers with reliable, high performance memory interconnect solutions that are cost competitive in the market,” Dr. Ron Torten, Senior Vice President of Operations and Information Technology, Inphi. “STATS ChipPAC delivered exceptional manufacturing performance, quality and responsiveness during this past year which was key to meeting our product and time-to-market goals. We appreciate their commitment to Inphi and commend them for a job well done.”
“Our close collaboration with STATS ChipPAC has ensured that Inphi was successful in delivering new DDR4 interconnect technology that achieves higher memory speeds and capacity, lower power consumption and greater signal integrity for next-generation data centers worldwide,” said Ramanan Thiagarajah, Vice President of Product and Test Engineering, Inphi. “STATS ChipPAC–s deep knowledge of advanced semiconductor packaging and test has been a competitive advantage to Inphi as we develop innovative solutions to meet our customers– big data requirements.”
Inphi–s memory interconnect products satisfy the growing demand for higher performance, higher bandwidth and improved data transmission in enterprise/cloud computing applications. Inphi utilizes STATS ChipPAC–s ® technology to achieve the high performance, high processing speeds and increased reliability in semiconductor solutions for next-generation cloud computing networks.
“It is an honor to be named Inphi–s Supplier of the Year. We are excited to be working with Inphi on their memory interconnect products for the rapidly growing and evolving cloud computing market,” said Hal Lasky, Executive Vice President and Chief Sales Officer, STATS ChipPAC. “We are pleased that our ® technology has proven once again to be a scalable technology that cost effectively addresses the increasing performance, bandwidth and speed requirements in the industry.”
Certain statements in this release, including statements regarding the Company–s expectations and intentions relating to the issue of the New Notes and use of proceeds thereof, are forward-looking statements that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; potential impairment charges; availability of financing; changes in our product mix; our capacity utilization; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; customer credit risks; disruption of our operations; shortages in supply of key components and disruption in supply chain; disruption of our operations and other difficulties related to the relocation of our China operations; loss of directors, key management or other personnel; defects or malfunctions in our testing equipment or packages; rescheduling or cancelling of customer orders; adverse tax and other financial consequences if the taxing authorities do not agree with our interpretation of the applicable tax laws; our ability to develop and protect our intellectual property; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; beneficial ownership of our ordinary shares by Jiangsu Changjiang Electronics Technology Co., Ltd. (“JCET”) which may have conflicting interests with other holders of our securities; our inability to capture all or any of the benefits from acquisitions and investments in other companies and businesses or from the acquisition of us by JCET; loss of customers or failure to compete effectively with our former Taiwan subsidiaries which we have recently divested; labor union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; and natural calamities and disasters, including outbreaks of epidemics and communicable diseases. STATS ChipPAC does not intend, and does not assume any obligation to update any forward-looking statements to reflect subsequent events or circumstances. References to “$” are to the lawful currency of the United States of America.
Inphi Corporation is a leading provider of high-speed, mixed-signal semiconductor solutions for the communications, computing and data center markets. Inphi–s end-to-end data transport platform delivers high signal integrity at leading-edge data speeds, addressing performance and bandwidth bottlenecks in networks, from fiber to memory. Inphi–s solutions minimize latency in computing environments and enable the rollout of next-generation communications infrastructure. Inphi–s solutions provide a vital interface between analog signals and digital information in high-performance systems, such as telecommunications transport systems, enterprise networking equipment, enterprise and data center servers, and storage platforms. To learn more about Inphi, visit .
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices throughout Asia, the United States and Europe. STATS ChipPAC is a business unit of Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET), a publicly-traded company on the Shanghai Stock Exchange. Further information is available at or . Information contained in these websites does not constitute a part of this release.
Low Yen Ling
Director, Corporate Finance
Tel: (65) 6824 7788
Fax: (65) 6720 7826
email:
Lisa Lavin
Deputy Director, Marketing Communications
Tel: (208) 867-9859
email:
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