BELLEVUE, WA — (Marketwired) — 08/22/13 — (NASDAQ: BSQR), a leading enabler of smart connected systems, today announced the availability of a new Bsquare Board Support Package (BSP) for the Texas Instruments (TI) OMAP 4 platform which will enable streamlined development on this high-performance TI platform — ideally suited for many enterprise and industrial applications.

The BSP empowers developers to build solutions using Windows® Embedded Compact 7. The release targets the OMAP 4470 Blaze MDP reference platform.

Key Features for the OMAP 4470 release:

Windows Embedded Compact 7 OAL with SMP multi-core support for ARM Cortex-A9

Full ARMv7 support (cache, NEON, VFP, MMU)

eMMC device driver support

“The BSP enables customers to bring Windows Embedded Compact 7-based devices to market more quickly,” said John Traynor, senior vice president of products for Bsquare, “and can be combined with other key Bsquare products and services such as the , and to create market-leading products and systems.”

The BSP may be customized to support other hardware requirements and software implementations. Bsquare complements this BSP with , integration, , and services that accelerate time-to-market for new embedded systems.

For more information about this new Bsquare Board Support Package for the Texas Instruments OMAP 4470 visit:

Bsquare, a global leader in embedded solutions, applies experience and expertise on leading platforms to create new connections with customers, new business models and to enable new ways of working and communicating. Bsquare serves customers by forging connections among the partners, people, tools, and technology needed to create smart connected systems. For more information, visit .

BSQUARE is a registered trademark of BSQUARE Corporation. All other product and company names herein may be trademarks of their respective owners.

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